JPH0540500Y2 - - Google Patents
Info
- Publication number
- JPH0540500Y2 JPH0540500Y2 JP5508288U JP5508288U JPH0540500Y2 JP H0540500 Y2 JPH0540500 Y2 JP H0540500Y2 JP 5508288 U JP5508288 U JP 5508288U JP 5508288 U JP5508288 U JP 5508288U JP H0540500 Y2 JPH0540500 Y2 JP H0540500Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- lead wire
- thin film
- paste layer
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000004973 liquid crystal related substance Substances 0.000 claims description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 15
- 239000010408 film Substances 0.000 claims description 12
- 239000002985 plastic film Substances 0.000 claims description 8
- 229920006255 plastic film Polymers 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 11
- 239000002775 capsule Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000005340 laminated glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5508288U JPH0540500Y2 (en]) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5508288U JPH0540500Y2 (en]) | 1988-04-22 | 1988-04-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01160423U JPH01160423U (en]) | 1989-11-07 |
| JPH0540500Y2 true JPH0540500Y2 (en]) | 1993-10-14 |
Family
ID=31280986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5508288U Expired - Lifetime JPH0540500Y2 (en]) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0540500Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4060249B2 (ja) * | 2003-07-29 | 2008-03-12 | 日本板硝子株式会社 | 調光体及び合わせガラス |
| JP5586390B2 (ja) * | 2010-09-16 | 2014-09-10 | 田淵電機株式会社 | 端子接続構造 |
-
1988
- 1988-04-22 JP JP5508288U patent/JPH0540500Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01160423U (en]) | 1989-11-07 |
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